Temporary bonding adhesives are used in manufacturing to hold two substrates together during a specific process and later must be separated and cleaned.  Example processes include the fabrication of electronic circuits onto thin substrates in semiconductor or display markets.  Thin substrates are much too fragile to be handled by normal tooling and as such are temporarily bonded onto rigid supports, commonly referred to a carriers. 

The adhesives are commonly formulated to exhibit properties that withstand the rigors of the manufacturing process such as thermal and chemical exposure, while allowing simple separation and cleaning when finished.  The properties can range in hardness from very soft and compliant, such as rubber, to hard and brittle like rosin systems.  Many interactions exist when applying, curing, and bonding. When choosing an adhesive, it is important to consider how substrate separation, cleaning will occur, as well as equipment requirements.  Most of the time, these final steps will govern adhesive choice.

Water Wash Technologies offers formulated thermoplastic and thermoset materials that exhibit thermal resistance >350C and can be debonded and cleaned in a batch process at throughputs that exceed 5X of the industry standard for single wafer tooling.  Our line card includes aqueous systems that meet stringent environmental safety criteria and eliminate the need for toxic organic solvents.  In cases where our adhesives may not match your project goals, our development team at DAETEC, LLC will design options to meet them.