Castable Flexible Substrate

Products

DaeCoat 210

Benefits

High Thermal Resistance
Hard, Rigid Coating
High Tensile Strength
Peelable from Glass when used with DaeCoat 310 Adhesive

Industries

Wafer Level and Chip Level Packaging (3DIC, MEMs, Various Bumping Technologies)
Display
LED
OLED

Anchor 4

DaeClean 210

Ready to Use Aqueous Alkali Detergent, Designed for Negative Tone Photoresist Removal in Semiconductor Manufacturing.

Cleans Compatibility = DaeCoat 515, DaeCoat 550, DaeCoat 615

MSDS

Product Report

Application Bulletin

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Castable Flexible Substrate

Water Wash Technologies offers polyimide for flexible substrate applications. The DaeCoat 210 is carefully formulated to provide low outgas, great thermal resistance, high adhesion and even higher tensile than conventional polyimides.