DaeCoat 310

Specialty Adhesive for Low Temperature OLED Processing.

Allows DaeCoat 210 or similar Polyimide Substrates to Peel From Glass.  

Two-Part System Provides Control Over Adhesion and Peel Force of Polyimide.

DaeCoat 350

Temporary or Permanent Bonding Agent for Display and Semiconductor Manufacturing Processes.

Bonds Substrates at Low Temperatures;  Exhibits High Thermal and Chemical Resistance.

Clean Compatibility = DaeClean 300

DaeCoat 515 Series

Water-Soluble Hard Coat for Laser and Handling Processes in Display and Semiconductor Manufacturing Processes.

Exhibits High Thermal Resistance and Easily Cleans in Aqueous Solutions.

Cleans Compatibility = DIW,  DaeClean 210, DaeClean 250

DaeCoat 550

Detergent-Soluble Coating for Laser Procssing in Display and Semiconductor Manufacturing Processes.

100% Solids, UV Curable System.

Cleans Compatibility = DaeClean 210, DaeClean 250

DaeCoat 615

Protective Coating and Temporary Bonding Agent for Semiconductor Manufacturing Processes.

Exhibits High Acid Resistance and Stable at Process Temperatures up to 200C.

Cleans Compatibility = DaeClean 210, DaeClean 250