As thinning and miniaturization influences display operations, the handling of thin and flexible glass is presented with many challenges.  Many facilities are now exploring organic substrates as polymers to replace glass. A fundamental part of this evolution is the application of low temperature polysilicon (LTPS), indium tin oxide (ITO) or other plasma deposited material used to build the transistor. A typical process flow involves the application and cure of a thin polymer to a glass carrier, device fabrication, and de-bonding by a peeling process.

Water Wash Technologies provides organic materials that can be used as substrates for flexible display manufacture processes. These substrate materials come in liquid form and can be casted and cured by various coating methods, for example spin, spray and slit. They are formulated to exhibit high thermal resistance ≤ 400°C (transparent) or ≤ 500°C (non-transparent) in vacuum and excellent chemical resistance to common process chemicals. The cured substrates exhibit high mechanical properties to provide support to fabricated devices.  

Along with the substrate materials, Water Wash Technologies also provides adhesives that can be used for both film type substrates and liquid cast substrate materials. Adhesives for film type substrates are thermal resistant to ≤350°C. Adhesives for liquid cast substrate materials are thermal resistant to ≤500°C. It is tuned to work along with DaeCoat^TM liquid substrate materials to facilitate bonding and debonding of the substrate from glass carriers. Debonding of substrates is made possible by tuning the ratio of the two parts adhesive. In cases where a specific adhesion force is requested, our development team at Daetec LLC will design options to meet the requirements and provide detailed customer report with bonding and debonding information.